Evaluation of the Influence of Gate Dielectric Materials on the Temperature Sensitivity of Silicon Nanowire Transistors
Keywords:
Electrostatic control, Temperature sensitivity, Transconductance, Nanowire transistors, Dielectric materialsAbstract
Nanowire-based sensors face a persistent bottleneck: improving electrostatic control via high-κ dielectrics often compromises their thermal responsiveness. To resolve this tension, we investigated the temperature-dependent drain current (250 K–450 K) of silicon nanowire transistors employing four distinct gate dielectrics: SiO₂, Al₂O₃, ZrO₂, and HfO₂. Our analysis reveals that the temperature sensitivity is inversely proportional to the dielectric constant (κ). Although HfO₂ (κ=25) provides the strongest gate control and maximum drive current, its superior electrostatic screening actually suppresses the channel's intrinsic thermal carrier-generation effect, resulting in minimal sensitivity. In stark contrast, SiO₂ (κ=3.9) allows the temperature-dependent carrier density to dominate transport, yielding the highest sensitivity, approximately 9×10⁻⁷ A/m/K. We conclude that dielectric engineering is not a one-size-fits-all proposition; rather, the choice of dielectric must be dictated by whether the target application prioritizes drive-current density (HfO₂) or thermal detectivity (SiO₂).
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Copyright (c) 2026 Nura Shehu, Sulaiman Gana, Bahijja Galadima

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